Title:
Cu ALLOY FILM AND Cu MULTILAYER FILM
Document Type and Number:
WIPO Patent Application WO/2016/132847
Kind Code:
A1
Abstract:
Proposed is a Cu alloy film which has low electrical resistance, excellent oxidation resistance and excellent wet etching workability. The Cu alloy film contains from 3.0 atom% to 19.0 atom% (inclusive) of Ni and one element X that is selected from the group consisting of Al, Zn, Mn and Sn, with the balance made up of Cu and unavoidable impurities. The content of the element X is x atom% or more that is determined by formula (1). In cases where the element X is Zn or Mn, the total content of Ni and the element X is 20.0 atom% or more, and in cases where the element X is Al or Sn, the total content of Ni and the element X is 16.0 atom% or more. x = 1.96 × Ni + 1.64 (1) (In formula (1), Ni represents the Ni content in atom% in the Cu alloy film.)
Inventors:
SHIDA YOKO
GOTO HIROSHI
KUGIMIYA TOSHIHIRO
GOTO HIROSHI
KUGIMIYA TOSHIHIRO
Application Number:
PCT/JP2016/052499
Publication Date:
August 25, 2016
Filing Date:
January 28, 2016
Export Citation:
Assignee:
KK KOBE SEIKO SHO(KOBE STEEL LTD ) (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C23C14/14; C23C14/34; H01B1/02; H01L21/3205; H01L21/768; H01L23/532
Foreign References:
| JPS62164893A | 1987-07-21 | |||
| JP2014114481A | 2014-06-26 | |||
| JP2015131998A | 2015-07-23 | |||
| JP2013120411A | 2013-06-17 |
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
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