Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2011/016217

A1

Disclosed is an electronic component wherein wiring and electrodes are produced by baking a paste, and which has wiring that connects to a glass or glass ceramic member. The electronic component can suppress an increase in electrical resistance resulting from oxidation, can suppress the generation of air bubbles in the glass or glass ceramic, and uses a Cu wiring material with excellent migration resistance. Further disclosed is a Cu-Al alloy powder that comprises Cu and preferably no more than 50 mass % of Al, and that is characterized by the surface of the aforementioned Cu-Al alloy powder being covered by an Al oxide coat layer with a thickness of no more than 80 nm. This powder is combined with a glass or a glass ceramic material to form a paste, and can be used to form wiring, electrodes, and/or contact members.

KATO TAKAHIKO (JP)
NAITO TAKASHI (JP)
AOYAGI TAKUYA (JP)
YAMAMOTO HIROKI (JP)
YOSHIDA MASATO (JP)
KATAYOSE MITSUO (JP)
TAKEDA SHINJI (JP)
TANAKA NAOTAKA (JP)
ADACHI SHUICHIRO (JP)

PCT/JP2010/004862

February 10, 2011

August 02, 2010

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HITACHI CHEMICAL CO LTD (JP)
KATO TAKAHIKO (JP)
NAITO TAKASHI (JP)
AOYAGI TAKUYA (JP)
YAMAMOTO HIROKI (JP)
YOSHIDA MASATO (JP)
KATAYOSE MITSUO (JP)
TAKEDA SHINJI (JP)
TANAKA NAOTAKA (JP)
ADACHI SHUICHIRO (JP)

B22F1/068; B22F1/107; B22F1/16; H01B1/22; H01B5/00; H01J11/12; H01J11/22; H01J11/24; H01J11/26; H01J11/34; H01L21/28; H01L21/288; H01L21/3205; H01L21/768; H01L23/52; H01L23/532; H01L31/04; H05K1/09

WO2009051254A1

2009-04-23

JP2004091907A

2004-03-25

POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)

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