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Title:
Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM
Document Type and Number:
WIPO Patent Application WO/2015/118611
Kind Code:
A1
Abstract:
Provided are: a Cu ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; a Cu core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60) is configured in a manner such that a solder bump (30) of a semiconductor chip (10) and an electrode (41) of a printed circuit board (40) are joined by a solder paste (12, 42). The solder bump (30) is formed by joining a Cu ball (20) to an electrode (11) of the semiconductor chip (10). This Cu ball (20) exhibits a purity of 99.9-99.995%, inclusive, a sphericity of 0.95 or higher, and a Vickers hardness of 20-60HV, inclusive.

Inventors:
KAWASAKI HIROYOSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
Application Number:
JP2014/052569
Publication Date:
August 13, 2015
Filing Date:
February 04, 2014
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B22F1/00; B22F1/02; B23K35/14; B23K35/22; B23K35/30; C22B15/14; C22C9/00; C22F1/00; C22F1/08; C25D7/00
Domestic Patent References:
WO1995024113A11995-09-08
WO2012120982A12012-09-13
WO2011114824A12011-09-22
WO2011118009A12011-09-29
Foreign References:
JP2003249598A2003-09-05
JP2011176124A2011-09-08
JP2007115857A2007-05-10
JPS6199646A1986-05-17
JP5408401B12014-02-05
JP5435182B12014-03-05
Other References:
See also references of EP 3103565A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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