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Title:
Cu BALL, OSP-TREATED Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND FOAM SOLDER, AND METHOD FOR MANUFACTURING Cu BALL
Document Type and Number:
WIPO Patent Application WO/2019/111898
Kind Code:
A1
Abstract:
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the solder bump 30 of a semiconductor chip 10 and the electrode 41 of a printed board 40 with solder pastes 12 and 42. The solder bump 30 is formed by bonding a Cu ball 20 to the electrode 11 of the semiconductor chip 10. The Cu ball 20 has a purity of 99.995-99.9995% by mass, and the total amount of at least one of Fe, Ag and Ni is 5.0-50.0 mass ppm. The amount of S is 1.0 mass ppm or less, and the amount of P is less than 3.0 mass ppm.

Inventors:
KAWASAKI HIROYOSHI (JP)
SOMA DAISUKE (JP)
Application Number:
PCT/JP2018/044572
Publication Date:
June 13, 2019
Filing Date:
December 04, 2018
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B22F1/00; B22F1/065; B22F1/17; B22F9/08; B23K35/14; B23K35/26; C22C9/00; C22C9/06; C22C13/00; H01L21/60; B22F1/102
Domestic Patent References:
WO2014087514A12014-06-12
WO2016170904A12016-10-27
Foreign References:
JPH117830A1999-01-12
JP2005036301A2005-02-10
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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