Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Cu-BASED SINTERED SLIDING MATERIAL, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/150271
Kind Code:
A1
Abstract:
This Cu-based sintered sliding material comprises a sintered body having a composition which includes, expressed in mass%, 7-35% of Ni, 1-10% of Sn, 0.9-3% of P, and 0.5-5% of C, the remainder being Cu and unavoidable impurities. The sintered body is provided with: alloy grains which include Sn and C, and which have a Cu-Ni-based alloy as a main component; a grain boundary phase which is distributed in a dispersed manner at boundaries of the alloy grains, and which has Ni and P as main components; and free graphite interposed between the boundaries of the alloy grains. The Cu-based sintered sliding material has a structure in which pores are formed in a dispersed manner at the boundaries of the alloy grains. The C content in a metal matrix including the alloy grains and the grain boundary phase is 0.02-0.20% expressed in mass%.

Inventors:
ISHII Yoshinari (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
Application Number:
JP2017/006343
Publication Date:
September 08, 2017
Filing Date:
February 21, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DIAMET CORPORATION (1-1 Kogane-cho 3-chome, Higashi-ku Niigata-sh, Niigata 40, 〒9508640, JP)
International Classes:
B22F5/00; B22F3/11; C22C9/02; C22C9/06; F16C17/02; F16C33/10; F16C33/12; F16C33/14
Domestic Patent References:
WO2012063786A12012-05-18
WO2012063786A12012-05-18
Foreign References:
JP2011214152A2011-10-27
JP2006199977A2006-08-03
Attorney, Agent or Firm:
SHIGA Masatake et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
Download PDF: