Cu COLUMN, Cu NUCLEAR COLUMN, SOLDER JOINT, AND THROUGH-SILICON VIA

Title:

Cu COLUMN, Cu NUCLEAR COLUMN, SOLDER JOINT, AND THROUGH-SILICON VIA

Document Type and Number:

WIPO Patent Application WO/2016/038686

Kind Code:

A1

Abstract:

Provided are: a Cu column having low Vickers hardness and small arithmetic average roughness; a Cu nuclear column; a solder joint; and a through-silicon via. The Cu column 1 according to the present invention has purity of 99.9 to 99.995% inclusive, arithmetic average roughness of 0.3 μm or less and Vickers hardness of 20 to 60 HV inclusive. The Cu column 1 cannot be melted at a temperature at which soldering is to be carried out and ensures a constant stand-off height (a space between substrates). Therefore, the Cu column 1 can be used suitably in three-dimensional mounting and narrow-pitch mounting.

Inventors:

KAWASAKI HIROYOSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)

Application Number:

PCT/JP2014/073808

Publication Date:

March 17, 2016

Filing Date:

September 09, 2014

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

H01L21/60; B22F1/00; H01L21/3205; H01L21/768; H01L23/50; H01L23/522; H05K3/34

Foreign References:

JP2003249598A	2003-09-05
JP2007115857A	2007-05-10
JP2000260933A	2000-09-22

Other References: