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Title:
Cu CORE BALL, SOLDER JOINT, FOAM SOLDER, AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2015/114771
Kind Code:
A1
Abstract:
The present invention suppresses occurrences of soft errors while assuring alignment properties when mounting a Cu core ball on an electrode. A Cu core ball (11) is provided with a Cu ball (1) and a metal layer (2) that coats the surface of this Cu ball (1). The metal layer (2) is formed from one or more elements selected from Ni, Co, and Fe. The Cu ball (1) is such that the purity is 99.9 - 99.995%, the U content is 5 ppb or less, the Th content is 5 ppb or less, the total amount for the content of at least one of Pb and Bi is 1 ppm or greater, the sphericity is 0.95 or greater, and the alpha dose is 0.0200 cph/cm2 or less.

Inventors:
KAWASAKI HIROYOSHI (JP)
KONDOH SHIGEKI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
Application Number:
JP2014/052099
Publication Date:
August 06, 2015
Filing Date:
January 30, 2014
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B22F1/00; B22F1/02; B23K35/14; B23K35/30; C22B15/14; C22F1/08; C25D7/00; H01L21/60; C22F1/00
Domestic Patent References:
WO2012120982A12012-09-13
WO2013042785A12013-03-28
WO2006085481A12006-08-17
WO2007125991A12007-11-08
Foreign References:
JP2011029395A2011-02-10
JP2005036301A2005-02-10
JP2001244286A2001-09-07
JP5408401B12014-02-05
JP5435182B12014-03-05
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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