Title:
Cu-Ni-Si ALLOY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/059707
Kind Code:
A1
Abstract:
This Cu-Ni-Si alloy contains 2.2-3.2 mass% Ni, 0.4-0.8 mass% Si, and 0.1-1.0 mass% Zn and the remainder is configured from Cu and unavoidable impurities. The mass ratio of Ni to Si is 4.0-5.5. The number of particles having a particle diameter of 0.1-3.0 µm and dispersed in a base metal (1) is 1×106-9×106 per unit square mm in a cross-section perpendicular to the rolling direction, and 1-30% of the particles are particles (2) having a particle diameter of 0.3-3.0 µm. The crystal grain size of the base metal (1) is less than 5 µm. The conductivity of the Cu-Ni-Si alloy is at least 60% IACS.
Inventors:
ITO TAKEFUMI (JP)
IWASHITA YUMIKO (JP)
YOSHIDA YUJI (JP)
OKUYAMA SHINGO (JP)
SAEGUSA KEI (JP)
IWASHITA YUMIKO (JP)
YOSHIDA YUJI (JP)
OKUYAMA SHINGO (JP)
SAEGUSA KEI (JP)
Application Number:
PCT/JP2014/077579
Publication Date:
April 21, 2016
Filing Date:
October 16, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C22C9/06; C22F1/00; C22F1/08; H01B1/02
Domestic Patent References:
| WO2011125153A1 | 2011-10-13 |
Foreign References:
| JP2006249516A | 2006-09-21 | |||
| JP2008056977A | 2008-03-13 | |||
| JP2009242926A | 2009-10-22 | |||
| JP2011214087A | 2011-10-27 | |||
| JPH10219374A | 1998-08-18 | |||
| JPH06184680A | 1994-07-05 | |||
| JP2008095185A | 2008-04-24 | |||
| JP2007305566A | 2007-11-22 | |||
| JP2008088549A | 2008-04-17 | |||
| JP2007157509A | 2007-06-21 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
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