Title:
Cu-Ni-Si-BASED COPPER ALLOY STRIP
Document Type and Number:
WIPO Patent Application WO/2018/180941
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a Cu-Ni-Si-based copper alloy strip in which the strength thereof is enhanced, surface unevenness after etching thereof is reduced, and the dimensional precision thereof after etching is enhanced. This Cu-Ni-Si-based copper alloy strip contains 1.5-4.5% by mass of Ni and 0.4-1.1% by mass of Si, the electrical conductivity thereof being 30% IACS or greater, the tensile strength thereof being 800 MPa or greater, the pole density of the crystal orientation at all Euler angles (φ1, Φ, φ2) thereof in an Euler angle representation being 12 or lower, and the change ∆b in warp amount in a longitudinal direction from before etching being 6 mm or less when a test piece having a width of 20 mm and a length of 200 mm with the longitudinal direction thereof being the direction parallel to a rolling direction is cut and half-etching thereof is performed using a ferric chloride aqueous solution being at a solution temperature of 40°C and adjusted to 47 degrees Baumé.
Inventors:
NAKATSUMA MUNEHIKO (JP)
TAKAHASHI TOMOAKI (JP)
TAKAHASHI TOMOAKI (JP)
Application Number:
PCT/JP2018/011574
Publication Date:
October 04, 2018
Filing Date:
March 23, 2018
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22C9/06; H01B1/02; C22F1/00; C22F1/08
Domestic Patent References:
| WO2016006053A1 | 2016-01-14 |
Foreign References:
| JP2013082968A | 2013-05-09 | |||
| JP2008013836A | 2008-01-24 | |||
| JP2017179511A | 2017-10-05 |
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
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