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Title:
Cu-Ni-Sn COPPER BASE SINTERED ALLOY EXCELLENT IN WEAR RESISTANCE AND BEARING MEMBER MADE OF THE ALLOY
Document Type and Number:
WIPO Patent Application WO/2008/001789
Kind Code:
A1
Abstract:
Disclosed is a Cu-Ni-Sn copper base sintered alloy having a chemical composition composed of 10-40% of Ni, 5-25% of Sn, and optionally if necessary, 0.1-0.9% of P, 1-10% of C, 0.3-6% of calcium fluoride and 0.3-6% of molybdenum disulfide, and the balance of Cu and unavoidable impurities. A phase having a chemical composition of Cu(4-x-y)NixSny (with x being 1.7-2.3 and y being 0.2-1.3) is dispersed in the alloy matrix.

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Inventors:
HARAKAWA TOSHIRO (JP)
SHIMIZU TERUO (JP)
MARUYAMA TSUNEO (JP)
Application Number:
PCT/JP2007/062841
Publication Date:
January 03, 2008
Filing Date:
June 27, 2007
Export Citation:
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Assignee:
MITSUBISHI MATERIALS PMG CORP (JP)
HARAKAWA TOSHIRO (JP)
SHIMIZU TERUO (JP)
MARUYAMA TSUNEO (JP)
International Classes:
C22C9/06; B22F5/00; C22C1/05; C22C9/02; F16C33/10; F16C33/12
Foreign References:
JPS62156240A1987-07-11
JPH11256206A1999-09-21
JP2006063398A2006-03-09
JPH02125829A1990-05-14
JPH08253826A1996-10-01
JPH05195117A1993-08-03
JP2001241445A2001-09-07
JPS6043903B21985-10-01
JPS62192549A1987-08-24
Attorney, Agent or Firm:
SHIGA, Masatake et al. (YaesuChuo-k, Tokyo 53, JP)
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