Title:
Cu-Zn ALLOY STRIP EXCELLENT IN THERMAL SEPARATION RESISTANCE FOR Sn PLATING AND Sn-PLATED STRIP THEREOF
Document Type and Number:
WIPO Patent Application WO/2007/139072
Kind Code:
A1
Abstract:
Disclosed is a Cu-Zn alloy strip which is improved in thermal separation resistance for Sn plating. Also disclosed is such a Cu-Zn alloy strip plated with Sn. Specifically disclosed is a Cu-Zn alloy strip consisting of 15-40% by mass of Zn and the balance of Cu and unavoidable impurities, wherein the total concentration of P, As, Sb and Bi is controlled to be 100 ppm by mass or less, the total concentration of Ca and Mg is controlled to be 100 ppm by mass or less, and the concentrations of O and S are respectively controlled to be 30 ppm by mass or less.
Inventors:
HATANO TAKAAKI (JP)
Application Number:
PCT/JP2007/060838
Publication Date:
December 06, 2007
Filing Date:
May 28, 2007
Export Citation:
Assignee:
NIPPON MINING CO (JP)
HATANO TAKAAKI (JP)
HATANO TAKAAKI (JP)
International Classes:
C22C9/04; C22F1/08; C25D5/10; C25D5/50; C25D7/00; H01B5/02; C22F1/00
Foreign References:
| JPH1025562A | 1998-01-27 | |||
| JP2004068026A | 2004-03-04 | |||
| JP2005226097A | 2005-08-25 |
Attorney, Agent or Firm:
AXIS Patent International (13-11 Nihonbashi 3-chome,Chuo-ku, Tokyo 27, JP)
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