Title:
CU ALLOY FILM FOR DISPLAY DEVICE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/011539
Kind Code:
A1
Abstract:
The present invention provides a display device which is provided with a Cu alloy film having high adhesion to an oxygen-containing insulator layer and a low electrical resistivity. The present invention relates to a Cu alloy film for a display device, said film having a laminated structure including a first layer (Y) composed of a Cu alloy containing, in total, 1.2-20 atm % of at least one element selected from among a group composed of Zn, Ni, Ti, Al, Mg, Ca, W, Nb and Mn, and a second layer (X) composed of pure Cu or a Cu alloy having Cu as a main component and an electrical resistivity lower than that of the first layer (Y). A part of or the whole first layer (Y) is directly in contact with an oxygen-containing insulator layer (27), and in the case where the first layer (Y) contains Zn or Ni, the thickness of the first layer (Y) is 10-100 nm, and in the case where the first layer (Y) does not contain Zn and Ni, the thickness of the first layer (Y) is 5-100 nm. The present invention also relates to a display device having the Cu alloy film.
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Inventors:
MIKI Aya (())
三木 綾 (())
KUGIMIYA Toshihiro (())
三木 綾 (())
KUGIMIYA Toshihiro (())
Application Number:
JP2011/066614
Publication Date:
January 26, 2012
Filing Date:
July 21, 2011
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO (10-26, Wakinohama-cho 2-chome Chuo-ku, Kobe-sh, Hyogo 85, 〒6518585, JP)
株式会社神戸製鋼所 (〒85 兵庫県神戸市中央区脇浜町二丁目１０番２６号 Hyogo, 〒6518585, JP)
MIKI Aya (())
三木 綾 (())
株式会社神戸製鋼所 (〒85 兵庫県神戸市中央区脇浜町二丁目１０番２６号 Hyogo, 〒6518585, JP)
MIKI Aya (())
三木 綾 (())
International Classes:
G09F9/30; C22C9/00; C22C9/01; C22C9/04; C22C9/05; C22C9/06; C22F1/08; C23C30/00; G02F1/1343; H01L21/28; H01L21/3205; H01L23/52; H01L29/786; C22F1/00
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims: