CU-BASE AMORPHOUS ALLOY - JAPAN SCIENCE & TECH CORP

Title:

CU-BASE AMORPHOUS ALLOY

Document Type and Number:

WIPO Patent Application WO/2002/053791

Kind Code:

A1

Abstract:

A Cu-base amorphous alloy which comprises an amorphous phase having a composition represented by the formula: Cu¿100-a-b?(Zr + Hf)¿a?Ti¿b? or Cu¿100-a-b-c-d?(Zr + Hf)¿a?Ti¿b?M¿c?T¿d?, wherein M is one or more elements selected from the group consisting of Fe, Cr, Mn, Ni, Co, Nb, Mo, W, Sn, Al, Ta and rare earth elements, T is one or more elements selected from the group consisting of Ag, Pd, Pt and Au, a, b, c and d represent atomic percentages and 5 $m(F) a $m(F) 55, 0 $m(F) b $m(F) 45, 30 $m(F) a + b $m(F) 60, 0.5 $m(F) c $m(F) 5, 0 $m(F) d $m(F) 10, in a volume percentage of 90 % or more. The Cu-base amorphous alloy has great capability of forming an amorphous phase and exhibits excellent mechanical properties together with excellent formability and can provide a rod material or a plate material having a diameter or a thickness of 1 mm or more and having a volume percentage for an amorphous phase of 90 % or more.

Inventors:

INOUE AKIHISA (JP)
ZHANG WEI (JP)
ZHANG TAU (JP)

Application Number:

PCT/JP2001/010410

Publication Date:

July 11, 2002

Filing Date:

November 28, 2001

Export Citation:

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Assignee:

JAPAN SCIENCE & TECH CORP (JP)
INOE AKIHISA (JP)
ZHANG WEI (JP)
ZHANG TAU (JP)

International Classes:

B22D11/06; B22D11/00; B22D21/00; B22D25/02; C22C45/00; C22C45/02; (IPC1-7): C22C45/00

Domestic Patent References:

WO2000026425A1

2000-05-11

Foreign References:

JPH08253847A	1996-10-01
JPS6059034A	1985-04-05
JP2000160308A	2000-06-13
JPH1161289A	1999-03-05
JPH0920968A	1997-01-21
EP0905268A1	1999-03-31
EP0905269A1	1999-03-31
JPH08253847A	1996-10-01
JPH11286069A	1999-10-19
SU1771133A1	1995-08-20

Other References: