Title:
CU-CO-SI-FE-P-BASED COPPER ALLOY HAVING EXCELLENT BENDING WORKABILITY AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2020/209485
Kind Code:
A1
Abstract:
The present invention provides a Cu-Co-Si-Fe-P-based copper alloy for electronic materials, which has an improved balance among strength, electrical conductivity, and bending workability, and a method for preparing same. The Cu-Co-Si-Fe-P-based copper alloy for an electronic material comprises: 1.2 to 2.5 mass% of Co; 0.2 to 1.0 mass% of Si; 0.01 to 0.5 mass% of Fe; 0.001 to 0.2 mass% of P; optionally 0.05 mass% or less of each of one or more selected from the group consisting of nickel (Ni), manganese (Mn), and magnesium (Mg); and the balance of Cu and inevitable impurities, wherein a weight ratio of cobalt (Co)/ silicon (Si) is 3.5 ≤ Co/Si ≤ 4.5, and a weight ratio of iron (Fe)/ phosphorus (P) is 1.0 < Fe/P. Having a bimodal structure, the alloy shows improved bending workability while maintaining electrical conductivity and strength.
Inventors:
LEE SIDAM (KR)
KWAK WONSHIN (KR)
JEONG WONSEOK (KR)
KWAK WONSHIN (KR)
JEONG WONSEOK (KR)
Application Number:
PCT/KR2020/000941
Publication Date:
October 15, 2020
Filing Date:
January 20, 2020
Export Citation:
Assignee:
POONGSAN CORP (KR)
International Classes:
C22C9/06; B21B3/00; B21B37/48; C22B15/00
Foreign References:
| JP2012201977A | 2012-10-22 | |||
| JP2013104078A | 2013-05-30 | |||
| JP2011032583A | 2011-02-17 | |||
| KR20110039372A | 2011-04-15 | |||
| JP2011246740A | 2011-12-08 | |||
| KR102005332B1 | 2019-10-01 |
Attorney, Agent or Firm:
KBK & ASSOCIATES (KR)
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