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Title:
CU-CO-SI SYSTEM COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING SAME, AND PART USING THE SHEET MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/186230
Kind Code:
A1
Abstract:
The present invention is a copper alloy sheet material having a chemical composition comprising, as mass%, 0.20%-6.00% for the total of Ni and Co, 0%-3.00% Ni, 0.20%-4.00% Co, and 0.10%-1.50% Si, and optionally a suitable amount of at least one of Fe, Mg, Zn, Mn, B, P, Cr, Al, Zr, Ti, and Sn, with the balance being Cu and unavoidable impurities. On the surface provided by polishing the sheet surface (rolled surface) of the copper alloy sheet material according to the present invention, when SB represents the area of the region where the crystal orientation difference from the brass {011} <211> orientation, measured by electron backscatter diffraction (EBSD), is within 10°, and SC represents the area of the region where the crystal orientation difference from the cube {001} <100> orientation is within 10°, SB/SC is at least 2.0 and the area percentage for SB in the surface is at least 5.0%.

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Inventors:
HYODO HIROSHI (JP)
SUDA HISASHI (JP)
Application Number:
PCT/JP2018/012327
Publication Date:
October 11, 2018
Filing Date:
March 27, 2018
Export Citation:
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Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/10; C22F1/08; C22F1/00
Domestic Patent References:
WO2013069376A12013-05-16
Foreign References:
JP2013095976A2013-05-20
JP2013104078A2013-05-30
JP2013173988A2013-09-05
JP2010242177A2010-10-28
JP2011017072A2011-01-27
JP2017179553A2017-10-05
JP2018035437A2018-03-08
JP2010073130A2010-04-02
JP2001152303A2001-06-05
JP2011117034A2011-06-16
JP2013032564A2013-02-14
JP2014156623A2014-08-28
JP2016047945A2016-04-07
Other References:
See also references of EP 3608430A4
Attorney, Agent or Firm:
KOMATSU Takashi (JP)
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