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Title:
CU-MG-P-BASED COPPER ALLOY BAR AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/104982
Kind Code:
A1
Abstract:
Disclosed is a Cu-Mg-P-based copper alloy bar of which the percentage of stress relaxation during extended use at high temperatures, the tensile strength, and the spring bending elastic limit are balanced at a high level. Further disclosed is a method for producing same. The copper alloy bar has a composition of 0.3-2% Mg and 0.001-0.1% P by mass, the remainder being Cu and unavoidable impurities. Using an EBSD method by means of a scanning electron microscope with an attached backscattered electron diffraction imaging system, the orientation of every pixel within the measurement area of the surface of the copper alloy bar using a step size of 0.5 μm is measured, and when considering the boundary at which the orientation difference between adjacent pixels is at least 5° to be a crystal grain boundary, the average value of the average orientation difference among every pixel within a crystal grain for every crystal grain is 3.8-4.2°, the tensile strength is 641-708 N/mm2, the spring bending elastic limit is 472-503 N/mm2, and the percentage of stress relaxation after heat treatment at 200°C for 1000 hours is 12-19%.

Inventors:
SAKURAI, Takeshi (Wakamatsu Plant, 128-7, Ohgi-Machi, Aizuwakamatsu-sh, Fukushima 22, 〒9658522, JP)
櫻井 健 (〒22 福島県会津若松市扇町128-7 三菱伸銅株式会社 若松製作所内 Fukushima, 〒9658522, JP)
KAMEYAMA, Yoshihiro (Wakamatsu Plant, 128-7, Ohgi-Machi, Aizuwakamatsu-sh, Fukushima 22, 〒9658522, JP)
Application Number:
JP2010/072808
Publication Date:
September 01, 2011
Filing Date:
December 17, 2010
Export Citation:
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Assignee:
MITSUBISHI SHINDOH CO., LTD. (4-7-35, Kitashinagawa Shinagawa-k, Tokyo 50, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川4-7-35 Tokyo, 〒1408550, JP)
SAKURAI, Takeshi (Wakamatsu Plant, 128-7, Ohgi-Machi, Aizuwakamatsu-sh, Fukushima 22, 〒9658522, JP)
櫻井 健 (〒22 福島県会津若松市扇町128-7 三菱伸銅株式会社 若松製作所内 Fukushima, 〒9658522, JP)
International Classes:
C22C9/00; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 701 Akiba Bldg., 3-3, Akihabara, Taito-k, Tokyo 06, 〒1100006, JP)
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Claims: