Title:
CU-NI-SI-CO BASED COPPER ALLY FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2010/064547
Kind Code:
A1
Abstract:
Provided is a Cu-Ni-Si-Co based copper alloy with which high levels of strength and conductivity are achieved, and that also has excellent permanent fatigue resistance. The copper alloy for electronic materials contains Ni: 1.0-2.5 mass%, Co: 0.5-2.5 mass%, and Si: 0.3-1.2 mass%, and the remainder comprises Cu and unavoidable impurities. Of the second phase particles precipitated in the matrix, the number density of those having a particle diameter of 5‑50 nm is 1 × 1012 to 1 × 1014/mm3, and the number density of those having a particle diameter of 5 nm to less than 20 nm is 3-6 as represented by the ratio to the number density of those having a particle diameter of 20‑50 nm.
Inventors:
KUWAGAKI,Hiroshi (Nippon Mining & Metals Co.Ltd.,1-1-2,Shirogane-cho,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2009/069715
Publication Date:
June 10, 2010
Filing Date:
November 20, 2009
Export Citation:
Assignee:
Nippon Mining & Metals Co.,Ltd. (10-1, Toranomon 2-chomeMinato-k, Tokyo 01, 〒1050001, JP)
日鉱金属株式会社 (〒01 東京都港区虎ノ門二丁目１０番１号 Tokyo, 〒1050001, JP)
日鉱金属株式会社 (〒01 東京都港区虎ノ門二丁目１０番１号 Tokyo, 〒1050001, JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; C22F1/00; C22F1/02
Attorney, Agent or Firm:
AXIS Patent International (Yushi Kogyo Kaikan, 13-11Nihonbashi 3-chome,Chuo-k, Tokyo 27, 〒1030027, JP)
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