Title:
CU-(NI,CO)-SI ALLOY WIRE, INSULATED WIRE, METHOD FOR PRODUCING CU-(NI,CO)-SI ALLOY WIRE, AND METHOD FOR PRODUCING INSULATED WIRE
Document Type and Number:
WIPO Patent Application WO/2020/209026
Kind Code:
A1
Abstract:
Provided is a Cu-(Ni,Co)-Si alloy wire that has flexibility (Vickers hardness of 150-200 HV) suitable for crimping connector terminals, in addition to electrical conductivity, strength, and elongation. Said Cu-(Ni,Co)-Si alloy wire contains 1.6-2.1 at% of Ni and/or Co; and 0.8-1.0 at% of Si, with the balance consisting of Cu and inevitable impurities, wherein the crystal grain size (average value) of the Cu matrix particles is 0.8-2.6 μm.
Inventors:
HIRONAGA RYUSUKE (JP)
HIKICHI YASUO (JP)
YAZAWA KYO (JP)
WAKAMATSU KAZUE (JP)
ARAI RYUICHI (JP)
HIKICHI YASUO (JP)
YAZAWA KYO (JP)
WAKAMATSU KAZUE (JP)
ARAI RYUICHI (JP)
Application Number:
PCT/JP2020/012115
Publication Date:
October 15, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
SWCC SHOWA CABLE SYSTEMS CO LTD (JP)
International Classes:
C22C9/06; C22F1/08; H01B5/02; H01B7/00; H01B13/00; C22F1/00
Domestic Patent References:
| WO2009057697A1 | 2009-05-07 |
Foreign References:
| JP2007305566A | 2007-11-22 | |||
| JP2011208232A | 2011-10-20 | |||
| JP2006225753A | 2006-08-31 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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