Title:
CURABLE ADHESIVE COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/210671
Kind Code:
A1
Abstract:
The present invention provides a curable adhesive composition which contains (A) a binder resin that has a reactive functional group and (B) a crosslinking agent that is reactive with the component (A), while having a molecular weight of 1000 or less, wherein the content of the component (B) is 0.1% by mass or more relative to the total amount of the active ingredients of this curable adhesive composition. A cured product that has a dielectric loss tangent of less than 0.0050 at 23°C at a frequency of 1 GHz is obtained by curing this curable adhesive composition. The present invention also provides a cured product of this curable adhesive composition.
Inventors:
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2022/015341
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08K5/3477; C08K5/29; C08L23/00; C08L71/12; C08L101/02; C09J7/35; C09J123/00; C09J171/12; C09J175/04; C09J201/02
Domestic Patent References:
| WO2021045125A1 | 2021-03-11 | |||
| WO2016147984A1 | 2016-09-22 |
Foreign References:
| JP2017031301A | 2017-02-09 | |||
| JP2020029557A | 2020-02-27 | |||
| JP2018035226A | 2018-03-08 | |||
| JP2018173549A | 2018-11-08 | |||
| JP2015086330A | 2015-05-07 | |||
| JP2011148919A | 2011-08-04 | |||
| JP2022053533A | 2022-04-05 | |||
| JP2021161130A | 2021-10-11 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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