Title:
CURABLE ADHESIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR MANUFACTURING CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/210673
Kind Code:
A1
Abstract:
Provided are: a curable adhesive composition including a first curing system, in which a cross-linking agent reacts with a binder resin having a reactive functional group and the reaction proceeds at a temperature of 120°C or less, and a second curing system, in which one or more compounds having a carbon-carbon double bond react and the reaction proceeds at a temperature of more than 120°C; a cured product thereof; and a method for manufacturing the cured product.
Inventors:
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2022/015344
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J1/02; C09J4/00; C09J7/35; C09J123/00; C09J171/12; C09J175/04; C09J201/02
Domestic Patent References:
| WO2021045125A1 | 2021-03-11 | |||
| WO2016147984A1 | 2016-09-22 |
Foreign References:
| JP2020029557A | 2020-02-27 | |||
| JP2018173549A | 2018-11-08 | |||
| JP2017031301A | 2017-02-09 | |||
| JP2015086330A | 2015-05-07 | |||
| JP2011148919A | 2011-08-04 | |||
| JP2018035226A | 2018-03-08 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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