Title:
CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH
Document Type and Number:
WIPO Patent Application WO/2019/218268
Kind Code:
A1
Abstract:
Provided is a curable adhesive composition for die attach that can eliminate the void issue, minimize the fillet, and has lower bond line thickness and tilt trend, when cured.
Inventors:
TI YANG (CN)
WU QILI (CN)
YAO WEI (CN)
ZHAO JIAWEN (CN)
WU QILI (CN)
YAO WEI (CN)
ZHAO JIAWEN (CN)
Application Number:
PCT/CN2018/087085
Publication Date:
November 21, 2019
Filing Date:
May 16, 2018
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
ABLESTIK SHANGHAI LTD (CN)
ABLESTIK SHANGHAI LTD (CN)
International Classes:
C09J9/02; C08K3/08; C09J11/04; H01B1/22; H05K1/11; H05K3/32; H05K3/40
Domestic Patent References:
| WO2017066563A1 | 2017-04-20 |
Foreign References:
| US20090155608A1 | 2009-06-18 | |||
| CN1244561A | 2000-02-16 | |||
| CN101878509A | 2010-11-03 | |||
| CN104425054A | 2015-03-18 |
Other References:
See also references of EP 3794086A4
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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