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Patent Searching and Data


Title:
CURABLE COMPOSITION AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2017/179536
Kind Code:
A1
Abstract:
A curable composition which contains 100 parts by mass of (A) a flexible epoxy resin, 1-150 parts by mass of (B) polymer fine particles, each having a core-shell structure having at least two layers that are a core layer and a shell layer, and 1-200 parts by mass of (C) an epoxy curing agent, and which is characterized in that: the glass transition temperature (Tg) of the core layers of the polymer fine particles (B) as calculated by mathematical formula (1) is higher than 0°C; and the type A durometer hardness as prescribed in JIS K6253-3 of a cured product that is obtained by curing this curable composition is 5-95 at 23°C. 1/Tg = Σ(Mi/Tgi) (1) (In the formula, Mi represents the weight fraction of a monomer i component selected from among butadiene and non-crosslinkable monomers constituting the core layers of the polymer fine particles (B); and Tgi represents the glass transition temperature (K) of a homopolymer of the monomer i.)

Inventors:
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2017/014681
Publication Date:
October 19, 2017
Filing Date:
April 10, 2017
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L63/00; C08L51/06; C09J11/08; C09J163/00
Foreign References:
JP2010077305A2010-04-08
JP2010090371A2010-04-22
JPH05214310A1993-08-24
JPH08183836A1996-07-16
Other References:
See also references of EP 3444301A4
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
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