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Patent Searching and Data


Title:
CURABLE COMPOSITION AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/033833
Kind Code:
A1
Abstract:
This invention provides a curable composition that exhibits good storage stability and cures rapidly at low temperatures. Said curable composition contains an organic peroxide, a pH adjuster, and a radically polymerizable compound that has a radically polymerizable group and a morpholine group. The pH of said curable composition is between 4 and 9, inclusive.

Inventors:
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
Application Number:
PCT/JP2014/072421
Publication Date:
March 12, 2015
Filing Date:
August 27, 2014
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/14; C08L63/00; C08L71/12; H01B1/00; H01B1/22
Foreign References:
JP2003089771A2003-03-28
JP2013032417A2013-02-14
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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