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Title:
CURABLE COMPOSITION AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/033834
Kind Code:
A1
Abstract:
This invention provides a curable composition that uses a phenoxy resin that makes it possible to obtain a curable composition that, when cured, is highly adhesive in high-temperature, high-humidity environments. This curable composition contains conductive particles and a phenoxy resin that has a hydrolyzable group in a side chain.

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Inventors:
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
Application Number:
PCT/JP2014/072422
Publication Date:
March 12, 2015
Filing Date:
August 27, 2014
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L71/10; C08F290/06; C08F299/04; C08G59/17; C08L63/00; H01B1/00; H01B1/22
Foreign References:
JP2002212262A2002-07-31
JP2003055435A2003-02-26
JP2002244327A2002-08-30
JP2002226549A2002-08-14
JP2000239539A2000-09-05
JP2001089420A2001-04-03
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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