Title:
CURABLE COMPOSITION, CURED ARTICLE, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2001/004213
Kind Code:
A1
Abstract:
A curable composition suitable for use in producing an organic material for electronic parts which is excellent in heat resistance, solvent resistance, and surface hardness properties. (1) The composition comprises (A) a polymer having a cyclic structure and (B) a polyfunctional epoxy compound which has at least three epoxy groups per molecule and two or more cyclic structures per molecule, wherein one of the carbon atoms constituting one cyclic structure is bonded through a single or double bond to one of the carbon atoms constituting another cyclic structure or two or more of the carbon atoms constituting one cyclic structure are shared with another cyclic structure. It optionally further contains (C) a hardener.
Inventors:
KODEMURA JUNJI (JP)
Application Number:
PCT/JP2000/004197
Publication Date:
January 18, 2001
Filing Date:
June 27, 2000
Export Citation:
Assignee:
NIPPON ZEON CO (JP)
KODEMURA JUNJI (JP)
KODEMURA JUNJI (JP)
International Classes:
C08L63/00; C08L65/00; H05K1/00; (IPC1-7): C08L63/00; B32B27/08; C08J5/18; C08L65/00; H01L23/29
Domestic Patent References:
| WO1998015595A1 | 1998-04-16 | |||
| WO1999003903A1 | 1999-01-28 |
Foreign References:
| JPH1060091A | 1998-03-03 | |||
| JPH09216935A | 1997-08-19 | |||
| US5783639A | 1998-07-21 | |||
| JPH10307388A | 1998-11-17 |
Attorney, Agent or Firm:
Wada, Yasuro (Ltd. 6-1 Marunouchi 2-chome Chiyoda-ku, Tokyo, JP)
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