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Title:
CURABLE COMPOSITION, CURED ARTICLE, AND USE OF CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/099501
Kind Code:
A1
Abstract:
Disclosed are: a curable composition comprising (A) a silane compound copolymer having a specific repeating unit, (B) an epoxy compound, and (C) a curing agent comprising an alicyclic acid anhydride having a carboxyl group and another alicyclic acid anhydride at a such a ratio that (A):[(B)+(C)] is 100:20 to 100:60 (by mass); a cured article produced by curing the composition; and a method for utilizing the composition as an adhesive agent for a fixing material for an optical element or a sealing material for a fixing material for an optical element. The curable composition can exhibit excellent heat resistance and transparency for a long period and enables the production of a cured article capable of exhibiting high adhesion properties even at high temperatures.

Inventors:
KASHIO MIKIHIRO (JP)
CHO RITSUMIN (JP)
Application Number:
PCT/JP2011/052709
Publication Date:
August 18, 2011
Filing Date:
February 09, 2011
Export Citation:
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Assignee:
LINTEC CORP (JP)
KASHIO MIKIHIRO (JP)
CHO RITSUMIN (JP)
International Classes:
C08L83/04; C08G59/42; C08K5/12; C08K5/49; C08L63/00; C09J163/00; C09J183/04; H01L21/52; H01L23/29; H01L23/31; H01L33/56; C08G77/04
Domestic Patent References:
WO2009104505A12009-08-27
WO2009101753A12009-08-20
WO2009119634A12009-10-01
WO2008102259A22008-08-28
Foreign References:
JP2009030013A2009-02-12
JP2008116904A2008-05-22
JP2008088415A2008-04-17
JP2008266585A2008-11-06
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
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Claims: