Title:
CURABLE COMPOSITION AND CURED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2013/031699
Kind Code:
A1
Abstract:
Provided are: a curable composition making it possible to obtain a cured article having excellent processing moldability, high heat resistance, and high enough Tg to be usable as a mold resin for an SiC power semiconductor; and a cured article thereof. The curable composition contains: 100 parts by mass of a compound of a molecule that has at least two partial structures represented by general formula (1), as a component (A); 0.5 to 3 parts by mass of a thermal radical generator, as a component (B); and 0 to 50 parts by mass of a different radical reactive compound, as a component (C) (in the formula, A represents a benzene ring or a cyclohexyl ring; R1 represents a C1-6 alkylene group; R2 represents a C1-4 alkyl group; a represents a number 0 or 1; b represents an integer 0 to 3; and c represents a number 1 or 2).
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Inventors:
HIWATARI KENICHIRO (JP)
TOMITA ATSUO (JP)
SAIKI TOMOAKI (JP)
MURATA KIYOSHI (JP)
TOMITA ATSUO (JP)
SAIKI TOMOAKI (JP)
MURATA KIYOSHI (JP)
Application Number:
PCT/JP2012/071486
Publication Date:
March 07, 2013
Filing Date:
August 24, 2012
Export Citation:
Assignee:
ADEKA CORP (JP)
HIWATARI KENICHIRO (JP)
TOMITA ATSUO (JP)
SAIKI TOMOAKI (JP)
MURATA KIYOSHI (JP)
HIWATARI KENICHIRO (JP)
TOMITA ATSUO (JP)
SAIKI TOMOAKI (JP)
MURATA KIYOSHI (JP)
International Classes:
C08F212/34; C08F2/44; C08F291/00
Foreign References:
| JP2004189901A | 2004-07-08 | |||
| JP2004323730A | 2004-11-18 | |||
| JP2004331774A | 2004-11-25 | |||
| JP2010202778A | 2010-09-16 | |||
| JP2007015945A | 2007-01-25 | |||
| JPS63210111A | 1988-08-31 | |||
| JP2007002187A | 2007-01-11 | |||
| JP2004027145A | 2004-01-29 | |||
| JP2005036085A | 2005-02-10 | |||
| JP2006269730A | 2006-10-05 | |||
| JP2011184650A | 2011-09-22 | |||
| JP2010222392A | 2010-10-07 | |||
| JP2000258932A | 2000-09-22 | |||
| JP2004189901A | 2004-07-08 | |||
| JP2010202778A | 2010-09-16 |
Other References:
See also references of EP 2749581A4
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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Claims: