CURABLE COMPOSITION, CURED PRODUCT, CAMERA MODULE AND METHOD FOR MANUFACTURING IMAGING DEVICE

WIPO Patent Application WO/2015/076309

A1

Provided is a curable composition which has low viscosity and provides a cured product having good heat resistance and good mold releasability. A curable composition which contains curable components including: 20-80% by mass of a compound (A) having (meth)acryloyloxy groups at both ends of an alkylene group; 5-50% by mass of a compound (B) having three (meth)acryloyloxy groups; 5-50% by mass of a compound (C) having four (meth)acryloyloxy groups; 0.1-20% by mass of a compound (D) having one or more (meth)acryloyloxy groups and a fluorine atom; 0-10% by mass of a compound (E) having one (meth)acryloyloxy group (excluding the compound (D)); and 0-40% by mass of a compound (F) having a fluorene skeleton and two (meth)acryloyloxy groups. The total of the compound (D) and the compound (E) is 0.1-20% by mass.

WO/1996/015075	FIBROUS GLASS BINDERS
JP2634849	[Title of Invention] Non-aqueous resin composition
JPH05255460	RESIN COMPOSITION, METHOD FOR FORMING TRANSPARENT THIN FILM AND TRANSPARENT THIN FILM

SEKIKAWA KENTA (JP)
EBATA KENICHI (JP)
KAIDA YURIKO (JP)
AMINO YOSUKE (JP)
HOMMA OSAMU (JP)

PCT/JP2014/080676

May 28, 2015

November 19, 2014

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ASAHI GLASS CO LTD (JP)

C08F220/20; C08F2/50; C08F220/22; G02B1/11; H01L27/14

WO2008155928A1

2008-12-24

JP2010041025A	2010-02-18
JP2010206189A	2010-09-16
JP2010262980A	2010-11-18
JP2011060818A	2011-03-24
JP2012049152A	2012-03-08
JP2012212019A	2012-11-01

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

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