CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION

Title:

CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2013/141360

Kind Code:

A1

Abstract:

The present invention is: a curable composition that comprises the following components (A) and (B) at a ratio of component (A):component (B) = 100:0.3 to 100:40 in terms of mass ratio between component (A) and component (B); a cured product obtained by curing said composition; and a method for using said composition as an adhesive for optical elements, etc. Component (A): a silane compound copolymer represented by formula (a-1) and having a weight-average molecular weight of from 800 to 30,000 (in the formula, R1 represents a hydrogen atom, etc., X0 represents a halogen atom, etc., D represents a single bond, etc., R2 represents a C1-20 alkyl group, etc., Z represents a hydroxyl group, etc., m and n represent a positive integer, and o, p, q, and r represent 0 or a positive integer). Component (B): a silane coupling agent having a nitrogen atom in the molecules thereof. With the present invention, it is possible to provide: a curable composition from which a cured product having excellent heat resistance and transparency as well as high adhesive strength can be obtained; a cured product obtained by curing said composition; and a method for using said composition as an adhesive for optical elements, etc. Formula (a-1): (CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZO2/2)o(R2SiZO2/2)p(CHR1X0-D-SiZ2O1/2)q(R2SiZ2O1/2)r

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Inventors:

MATSUI MASAMI (JP)
KASHIO MIKIHIRO (JP)

Application Number:

PCT/JP2013/058301

Publication Date:

September 26, 2013

Filing Date:

March 22, 2013

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

C08L83/08; C08K5/544; C09J183/08; H01L21/52; H01L23/29; H01L23/31; H01L33/56; C08G77/22

Domestic Patent References:

WO2009104505A1	2009-08-27
WO2009101753A1	2009-08-20
WO2011111667A1	2011-09-15

Foreign References:

JP2009030013A	2009-02-12
JP2012037866A	2012-02-23
JP2011002517A	2011-01-06
JP2010152302A	2010-07-08
JP2012155200A	2012-08-16
JP2004359933A	2004-12-24
JP2005263869A	2005-09-29
JP2006328231A	2006-12-07
JPH07309927A	1995-11-28
JP2009001752A	2009-01-08

Other References: