CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE

WIPO Patent Application WO/2016/031731

A1

　The present invention is: a curable composition containing components (A) through (D), the curable composition containing component (A) and component (B) in a mass ratio indicated by the expression [component (A):component (B)] = 100:0.3-100:20; a cured product; a method for using the curable composition; and an optical device. (A): a silane compound (co)polymer represented by formula (a-1) or formula (a-2) (where X0 represents a cyano group or the like, D represents a single bond or the like, R1 represents a hydrogen atom or the like, R2 represents a C1-20 alkyl group or the like, R3 represents a C1-10 alkyl group, Z1-Z5 represent hydroxyl groups or the like, m, n, and s represent positive integers, and o, p, q, r, t, and u represent 0 or positive integers). (B): microparticles having an average primary particle diameter of more than 0.04 µm and less than or equal to 8 µm. (C): a silane coupling agent having a nitrogen atom in the molecules thereof. (D): a silane coupling agent having an acid anhydride structure in the molecules thereof. The present invention provides: a curable composition with which a cured product is obtained having excellent peeling resistance and heat resistance, and high adhesive strength; a cured product obtained by curing the composition; a method for using the curable composition as an adhesive or the like for an optical element; and an optical device. (CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZ1O2/2)o(R2SiZ2O2/2)p(CHR1X0-D-SiZ3 2O1/2)q(R2SiZ4 2O1/2)r ...(a-1) R3SiO3/2)s(R3SiZ5O2/2)t(R3SiZ5 2O1/2)u...(a-2)

NAKAYAMA HIDEKAZU (JP)
MATSUI MASAMI (JP)
KASHIO MIKIHIRO (JP)

PCT/JP2015/073609

March 03, 2016

August 21, 2015

Click for automatic bibliography generation  

LINTEC CORP (JP)

C08L83/04; C08K3/00; C08K3/36; C08K5/5435; C08K5/544; C08K9/06; C09J11/04; C09J11/06; C09J183/06; C09J183/08; C09K3/10; H01L23/29; H01L23/31; H01L33/56

WO2014069508A1	2014-05-08
WO2013141360A1	2013-09-26
WO2011111667A1	2011-09-15
WO2009101753A1	2009-08-20
WO2009104505A1	2009-08-27

JP2002313621A	2002-10-25
JP2009138059A	2009-06-25
JP2011173738A	2011-09-08
JP2007507583A	2007-03-29

See also references of EP 3187547A4

OHISHI HARUHITO (JP)
Haruhito Oishi (JP)

View/Download PDF      PDF Help

Previous Patent: CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABL...

Next Patent: CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE