Title:
CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/031733
Kind Code:
A1
Abstract:
The present invention relates to: a curable composition which contains the components (A)-(E) described below so that the mass ratio of the component (A) to the component (B), namely (A):(B) is from 100:0.3 to 100:20; a cured product; a method for using a curable composition; and an optical device. (A) a silane compound polymer represented by formula (a) (wherein R1 represents an alkyl group having 1-10 carbon atoms; Z represents a hydroxyl group or the like; s represents a positive integer; and each of t and u represents 0 or a positive integer) (B) fine particles having an average primary particle diameter of more than 0.04 μm but 8 μm or less (C) a silane coupling agent having a nitrogen atom (D) a silane coupling agent having an acid anhydride structure (E) a silane coupling agent having a sulfur atom-containing functional group The present invention provides: a curable composition which enables the achievement of a cured product that has excellent releasability and excellent heat resistance, while having high adhesive force; a cured product which is obtained by curing the composition; a method for using the composition as an adhesive for optical elements, and the like; and an optical device. (R1SiO3/2)s(R1SiZO2/2)t(R1SiZ2O1/2)u...(a)
Inventors:
MATSUI MASAMI (JP)
NAKAYAMA HIDEKAZU (JP)
KASHIO MIKIHIRO (JP)
NAKAYAMA HIDEKAZU (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2015/073611
Publication Date:
March 03, 2016
Filing Date:
August 21, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08L83/04; C08K3/00; C08K3/36; C08K5/5435; C08K5/544; C08K5/548; C08K9/06; C09J11/04; C09J11/06; C09J183/06; C09J183/08; C09K3/10; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2014069508A1 | 2014-05-08 | |||
| WO2013141360A1 | 2013-09-26 | |||
| WO2011111667A1 | 2011-09-15 | |||
| WO2009101753A1 | 2009-08-20 | |||
| WO2009104505A1 | 2009-08-27 |
Foreign References:
| JP2002313621A | 2002-10-25 | |||
| JP2009138059A | 2009-06-25 | |||
| JP2011173738A | 2011-09-08 | |||
| JP2007507583A | 2007-03-29 |
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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