Title:
CURABLE COMPOSITION, CURED PRODUCT, PRODUCTION METHOD FOR CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/071234
Kind Code:
A1
Abstract:
Provided are: a curable composition which contains a filler and a compound A having a group A that is a hydrocarbon group in which at least one hydrogen atom is substituted with a fluorine atom and a group B that is at least one group which is selected from the group consisting of a nucleophilic functional group, an electrophilic functional group, an alkoxysilyl group, and a group having an ethylenically unsaturated bond and may be protected; a cured product obtained by curing said curable composition; a production method for a cured product; a semiconductor package comprising said cured product; and a production method for a semiconductor package, comprising said production method for a cured product.
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Inventors:
AOSHIMA TOSHIHIDE (JP)
SHIMADA KAZUTO (JP)
NOGOSHI KEISUKE (JP)
SHIMADA KAZUTO (JP)
NOGOSHI KEISUKE (JP)
Application Number:
PCT/JP2023/035236
Publication Date:
April 04, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L63/00; C08K3/013; C08K5/5415; C08L35/00; C08L61/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
SIKS & CO. (JP)
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