Title:
CURABLE COMPOSITION AND CURED RESIN
Document Type and Number:
WIPO Patent Application WO/2012/081393
Kind Code:
A1
Abstract:
Provided is a curable composition which, before being cured, has a low viscosity and therefore exhibits excellent fluidity, and which can be speedily cured by heating to form a cured resin that is inhibited from causing blur of light (chromatic aberration) and that exhibits excellent transparency and heat resistance. This curable composition is characterized by comprising (A) an epoxy compound in which an aliphatic ring is bonded to an epoxy group by a single bond or with a connecting group therebetween and which has no ester bond and (B) an epoxy compound which has both an aliphatic ring and an ester bond at an (A)/(B) weight ratio of 5/95 to 50/50.
Inventors:
TAKENAKA HIROKI (JP)
KUBO TAKASHI (JP)
KUBO TAKASHI (JP)
Application Number:
PCT/JP2011/077503
Publication Date:
June 21, 2012
Filing Date:
November 29, 2011
Export Citation:
Assignee:
DAICEL CORP (JP)
TAKENAKA HIROKI (JP)
KUBO TAKASHI (JP)
TAKENAKA HIROKI (JP)
KUBO TAKASHI (JP)
International Classes:
C08L63/00
Domestic Patent References:
| WO2008044618A1 | 2008-04-17 |
Foreign References:
| JP2003040972A | 2003-02-13 | |||
| JP2009013264A | 2009-01-22 | |||
| JPH10226745A | 1998-08-25 | |||
| JPH10168106A | 1998-06-23 | |||
| JPH03247619A | 1991-11-05 | |||
| JPH10156952A | 1998-06-16 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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Claims:
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