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Title:
CURABLE COMPOSITION AND CURED SUBSTANCE THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/114986
Kind Code:
A1
Abstract:
[Problem] To provide a curable composition characterized in that a cured substance obtained by curing the curable composition has excellent transparency, heat resistance, and surface hardness, and has a low Abbe number. [Solution] A curable composition including silica fine particles (a), a (meth)acrylate compound having two or more ethylenically unsaturated groups (b), a (meth)allyl compound having two or more ethylenically unsaturated groups and an aromatic ring structure (c), and a polymerization initiator (d), characterized in that the silica fine particles (a) are surface-treated with a specific silane compound (e) and a silane compound (f).

Inventors:
URAKAWA YOSHIFUMI (JP)
YAMAKI SHIGERU (JP)
ISHII NOBUAKI (JP)
Application Number:
PCT/JP2012/053755
Publication Date:
August 30, 2012
Filing Date:
February 17, 2012
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
URAKAWA YOSHIFUMI (JP)
YAMAKI SHIGERU (JP)
ISHII NOBUAKI (JP)
International Classes:
C08F2/44; C08F292/00; G02B1/04
Domestic Patent References:
WO2010116841A12010-10-14
Foreign References:
JP2002333501A2002-11-22
JP2004051851A2004-02-19
JPH06322087A1994-11-22
JPH1077321A1998-03-24
JPH10298252A1998-11-10
JP2003090901A2003-03-28
JP2002097217A2002-04-02
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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Claims: