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Title:
CURABLE COMPOSITION HAVING IMPROVED WATER-RESISTANT ADHESIVENESS
Document Type and Number:
WIPO Patent Application WO/2017/138463
Kind Code:
A1
Abstract:
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant adhesiveness thereto and which is reduced in burden on the environment or human body. A curable composition comprising an organic polymer (A) containing reactive silicon-containing groups and a cyclic N-hydroamide compound (B) which includes a cyclic structure wherein the number of ring-constituting atoms is 6 or less and which has a carboxamide bond (-CONH-) within the cyclic structure gives excellent adhesion strength when used especially as an adhesive for wood. The satisfactory shear strength can be maintained even after a water resistance test.

Inventors:
ITANO YU (JP)
SMITS WENDY (BE)
Application Number:
PCT/JP2017/004090
Publication Date:
August 17, 2017
Filing Date:
February 03, 2017
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/10; C08K5/34; C09J11/06; C09J133/06; C09J171/02; C09J183/12; C09J201/10
Foreign References:
US20170044302A12017-02-16
JP2015218310A2015-12-07
JP2014234396A2014-12-15
JP2010509483A2010-03-25
Other References:
See also references of EP 3409730A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
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