Title:
CURABLE COMPOSITION INCLUDING SILICON-CONTAINING HIGHLY-BRANCHED POLYMER
Document Type and Number:
WIPO Patent Application WO/2014/054698
Kind Code:
A1
Abstract:
[Problem] To provide a composition for forming a hard coat layer, the composition having excellent smoothness and lipophilic properties (fingerprint resistance) while not losing lipophilic properties during spray coating, and being capable of forming a smooth surface devoid of coating irregularity. [Solution] A curable composition including (a) 0.01 to 10 parts by mass of a specific lipophilic highly branched polymer, (b) 0.0001 to 1 part by mass of a specific silicon-containing highly-branched polymer, (c) 100 parts by mass of an active-energy-ray-curable polyfunctional monomer, and (d) 0.1 to 25 parts by mass of a polymerization initiator for generating radicals by active energy rays; a cured film obtained from the composition; and a laminate obtained using the composition.
Inventors:
HARAGUCHI MASAYUKI (JP)
MATSUYAMA MOTONOBU (JP)
MATSUYAMA MOTONOBU (JP)
Application Number:
PCT/JP2013/076835
Publication Date:
April 10, 2014
Filing Date:
October 02, 2013
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08F2/44; B05D7/24; B32B27/00; C08F2/48; C09D4/02; C09D4/06; C09D7/47
Domestic Patent References:
| WO2012128214A1 | 2012-09-27 | |||
| WO2009133784A1 | 2009-11-05 |
Foreign References:
| JP2008255301A | 2008-10-23 | |||
| JP2010077328A | 2010-04-08 | |||
| JP2007046049A | 2007-02-22 | |||
| JP2007145884A | 2007-06-14 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
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