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Title:
CURABLE COMPOSITION FOR INK-JET PRINTING, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/063144
Kind Code:
A1
Abstract:
Provided is a curable composition for ink-jet printing which, when applied and cured, can give a cured object having heightened adhesiveness to a substrate and having heightened resistance to high-temperature alkali solutions.　The curable composition for ink-jet printing according to the present invention comprises a first (meth)acrylate compound, which has a plurality of (meth)acryloyl groups and an alicyclic skeleton, a second (meth)acrylate compound, which is represented by formula (1), a photopolymerization initiator, and a colorant.

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Inventors:
INOUE TAKANORI (JP)
HONDA MASUMI (JP)
FUKUDA TAKASHI (JP)
UEDA MICHIHISA (JP)
WATANABE TAKASHI (JP)
Application Number:
PCT/JP2023/034306
Publication Date:
March 28, 2024
Filing Date:
September 21, 2023
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09D11/30; B41J2/01; B41M5/00
Domestic Patent References:
WO2021200258A12021-10-07
Foreign References:
JP2018065911A2018-04-26
JP2020152800A2020-09-24
JP2010143982A2010-07-01
Attorney, Agent or Firm:
OSAKA FRONT (JP)
Download PDF:
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