Title:
CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED OBJECT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/031728
Kind Code:
A1
Abstract:
The present invention is: a curable composition that contains components (A) to (C), the composition characterized by containing component (A) and component (B) at a mass ratio of [component (A) : component (B)]=100:0.3 to 100:50; a method for producing same; a cured object formed by curing the curable composition; a method for using the curable composition as an adhesive for an optical element fixing material or as a sealing material for an optical element fixing material; and an optical device. Component (A): a curable polysilsesquioxane compound having repeating units, represented by formula (a-1): R1SiO3/2 (In the formula, R1 represents a C1-10 alkyl group having a substituent group or not having a substituent group, or an aryl group having a substituent group or not having a substituent group). Component (B): particles having an average primary particle diameter of 5-40 nm. Component (C): a silane coupling agent having a nitrogen atom within the molecules thereof. This invention provides: a curable composition that produces a cured object having excellent adhesiveness, peeling resistance, and heat resistance, and has excellent workability in a coating step; a method for producing same; a cured object formed by curing the curable composition; a method for using the curable composition as an adhesive for an optical element fixing material or as a sealing material for an optical element fixing material; and an optical device.
Inventors:
KASHIO MIKIHIRO (JP)
NAKAYAMA HIDEKAZU (JP)
MATSUI MASAMI (JP)
NAKAYAMA HIDEKAZU (JP)
MATSUI MASAMI (JP)
Application Number:
PCT/JP2015/073606
Publication Date:
March 03, 2016
Filing Date:
August 21, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08L83/04; C08K3/00; C08K5/544; C09J11/04; C09J11/06; C09J183/04; C09K3/10; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2014069508A1 | 2014-05-08 | |||
| WO2013141360A1 | 2013-09-26 | |||
| WO2011111667A1 | 2011-09-15 | |||
| WO2009101753A1 | 2009-08-20 | |||
| WO2009104505A1 | 2009-08-27 |
Foreign References:
| JP2002313621A | 2002-10-25 | |||
| JP2009138059A | 2009-06-25 | |||
| JP2011173738A | 2011-09-08 | |||
| JP2007507583A | 2007-03-29 |
Other References:
See also references of EP 3187545A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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