Title:
CURABLE COMPOSITION FOR PRODUCING RESIN SHEET THAT IMPARTS TOUCH-CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2017/150701
Kind Code:
A1
Abstract:
Provided is a curable composition for producing a resin sheet having exceptional heat resistance in addition to rigidity and toughness. A curable composition for producing a resin sheet containing the following component (A), component (B), and optional component (C), the curable composition containing a proportion of 40-80% by weight of component (A), 60-20% by weight of component (B), and 0-40% by weight of component (C) in a total of 100% by weight of component (A), component (B), and component (C). Component (A): an oligomer or polymer having a weakly basic group with a conjugate acid pKa of from -3 to 1; component (B): a compound having a carboxyl group and an ethylenic unsaturated group; component (C): an ethylenic-unsaturated-group-containing compound other than component (A) and component (B)
Inventors:
TSUDA TAKASHI (JP)
KAMIMURA HIROYUKI (JP)
KOIKE NOBUAKI (JP)
OKAZAKI EIICHI (JP)
KAMIMURA HIROYUKI (JP)
KOIKE NOBUAKI (JP)
OKAZAKI EIICHI (JP)
Application Number:
PCT/JP2017/008476
Publication Date:
September 08, 2017
Filing Date:
March 03, 2017
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08L101/02; C08F290/06; C08K5/09; G02B5/30
Domestic Patent References:
| WO1990015831A1 | 1990-12-27 |
Foreign References:
| JP2012162652A | 2012-08-30 | |||
| JP2015021089A | 2015-02-02 |
Download PDF: