Title:
CURABLE COMPOSITION FOR PRODUCTION OF RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2018/092700
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable composition from which a resin sheet having excellent stiffness and toughness can be produced, more specifically a curable composition from which a thick resin sheet that is superior in all of physical properties, i.e., a bending elastic modulus, a bending fracture strain and impact resistance, in a bending test and is reduced in surface unevenness and distortion can be produced.
A curable composition for the production of a resin sheet, said composition comprising components (A), (B) and (C) as mentioned below; a resin sheet which comprises a cured product of the composition; and a method for producing the resin sheet: component (A): a compound having an ethylenically unsaturated group, component (B): a polymer having an acidic group, and component (C): a radical polymerization initiator.
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Inventors:
KAMIMURA HIROYUKI (JP)
TSUDA TAKASHI (JP)
OKAZAKI EIICHI (JP)
TSUDA TAKASHI (JP)
OKAZAKI EIICHI (JP)
Application Number:
PCT/JP2017/040681
Publication Date:
May 24, 2018
Filing Date:
November 13, 2017
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08F2/44; C08F2/46; C08F265/02; C08F290/06
Domestic Patent References:
WO2016098856A1 | 2016-06-23 |
Foreign References:
JPH11335655A | 1999-12-07 | |||
JP2000212526A | 2000-08-02 | |||
JP2002012640A | 2002-01-15 | |||
JP2015010192A | 2015-01-19 | |||
JP2013119604A | 2013-06-17 | |||
JP2005316174A | 2005-11-10 | |||
JP2003226770A | 2003-08-12 | |||
JP2017141343A | 2017-08-17 |
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