CURABLE COMPOSITION AND SEALING METHOD FOR CERAMIC SIDING BOARDS

Title:

CURABLE COMPOSITION AND SEALING METHOD FOR CERAMIC SIDING BOARDS

Document Type and Number:

WIPO Patent Application WO/2004/011553

Kind Code:

A1

Abstract:

A curable composition capable of crosslinking in the presence of moisture to give rubbery cured articles, which comprises (A) a polyoxyalkylene polymer (such as polyoxy- propylene) having reactive silicon groups, (B) a vinyl polymer (such as (meth)acrylic ester polymer) having reactive silicon groups, and (C) a low-molecular polyoxyalkylene plasticizer (such as polyoxypropylene); and a sealing method for ceramic siding boards, characterized by filling the curable composition as a sealant and then curing it.

Inventors:

IWAKIRI HIROSHI (JP)
KOMITSU SHINTARO (JP)

Application Number:

PCT/JP2003/008741

Publication Date:

February 05, 2004

Filing Date:

July 09, 2003

Export Citation:

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Assignee:

KANEKA CORP (JP)
IWAKIRI HIROSHI (JP)
KOMITSU SHINTARO (JP)

International Classes:

C08G65/336; C08K5/06; C08L71/02; E04F13/08; E04F13/14; C08L43/04; (IPC1-7): C08L71/02; C08L33/06; C09K3/10; E04F13/08

Foreign References:

JP2002129004A	2002-05-09
JP2002069288A	2002-03-08
JP2002155201A	2002-05-28
JP2002179904A	2002-06-26
JP2002194204A	2002-07-10
JP2002201350A	2002-07-19
JPH1112455A	1999-01-19
JP2001172609A	2001-06-26
JPH04266986A	1992-09-22

Other References: