Title:
CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
Document Type and Number:
WIPO Patent Application WO/2012/014560
Kind Code:
A1
Abstract:
The present invention provides a curable composition for semiconductor encapsulation which gives a cured object excellent in terms of heat resistance, high-temperature electrical insulating properties, flexibility, and heat cycle resistance. Also provided is a semiconductor device encapsulated by curing this curable composition. The curable composition for semiconductor encapsulation comprises a specific SiH-containing siloxane compound as ingredient (A), a specific vinyl-containing siloxane compound as ingredient (B), a compound having at least three SiH or vinyl groups as ingredient (C), and a hydrosilylation catalyst as ingredient (D).
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Inventors:
HIWATARI, Ken-ichiro (2-35 Higashiogu 7-chome, Arakawa-k, Tokyo 54, 〒1168554, JP)
日渡 謙一郎 (〒54 東京都荒川区東尾久７丁目２番３５号 株式会社ＡＤＥＫＡ内 Tokyo, 〒1168554, JP)
日渡 謙一郎 (〒54 東京都荒川区東尾久７丁目２番３５号 株式会社ＡＤＥＫＡ内 Tokyo, 〒1168554, JP)
Application Number:
JP2011/062066
Publication Date:
February 02, 2012
Filing Date:
May 26, 2011
Export Citation:
Assignee:
ADEKA CORPORATION (2-35, Higashiogu 7-chome Arakawa-k, Tokyo 54, 〒1168554, JP)
株式会社ＡＤＥＫＡ (〒54 東京都荒川区東尾久７丁目２番３５号 Tokyo, 〒1168554, JP)
HIWATARI, Ken-ichiro (2-35 Higashiogu 7-chome, Arakawa-k, Tokyo 54, 〒1168554, JP)
株式会社ＡＤＥＫＡ (〒54 東京都荒川区東尾久７丁目２番３５号 Tokyo, 〒1168554, JP)
HIWATARI, Ken-ichiro (2-35 Higashiogu 7-chome, Arakawa-k, Tokyo 54, 〒1168554, JP)
International Classes:
C08L83/05; C08L83/07; H01L23/29; H01L23/31
Attorney, Agent or Firm:
HATORI, Osamu (AKASAKA HKN BLDG, 6F. 8-6, Akasaka 1-chome, Minato-k, Tokyo 52, 〒1070052, JP)
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Claims: