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Title:
CURABLE COMPOSITION SET FOR INK-JET PRINTING, CURED OBJECT, PRODUCTION METHOD THEREFOR, PRINTED WIRING BOARD, AND FAN-OUT WAFER LEVEL PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/225779
Kind Code:
A1
Abstract:
[Problem] To provide a two-pack type curable composition set for ink-jet printing which can accommodate highly fine patterns, is tack-free, and is suitable for straightening the warpage of pseudo-wafers and which has excellent heat resistance and, despite this, is excellent in terms of suitability for delivery and storage stability. [Solution] The two-pack type curable composition set for ink-jet printing is a two-pack type curable composition for ink-jet printing which comprises a main ingredient and a hardener, and is characterized in that the main ingredient contains a thermally crosslinking ingredient and the hardener contains a heat-curing catalyst ingredient and that the main ingredient and the hardener each contain an ingredient which cures with actinic rays.

Inventors:
ITO HIDEYUKI (JP)
SATO KAZUYA (JP)
ARAI YASUAKI (JP)
Application Number:
PCT/JP2018/021683
Publication Date:
December 13, 2018
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C09D11/30; B41J2/01; C09D11/38; C09D11/54; H01L23/12; H01L23/29; H01L23/31; H05K3/28
Domestic Patent References:
WO2013157271A12013-10-24
WO2012039379A12012-03-29
WO2016129670A12016-08-18
WO2012132423A12012-10-04
WO2017056663A12017-04-06
Foreign References:
JP2006159746A2006-06-22
JP2009272609A2009-11-19
JP2015090903A2015-05-11
JP2015089540A2015-05-11
JP2013042090A2013-02-28
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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