Title:
CURABLE COMPOSITION OF THERMOSETTING TYPE
Document Type and Number:
WIPO Patent Application WO/2017/188185
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable composition of thermosetting type, said curable composition comprising a polymer having a hydrolyzable silyl group, which does not cure over a long time at room temperature but cures immediately upon heating and a cured product of which is free from blisters even after a heating process.
This purpose can be achieved by a curable composition of thermosetting type which comprises a polyoxyalkylene-based polymer (A) having a hydrolyzable silyl group, in particular, a triethoxysilyl group, and a tetravalent monoalkyl tin (B).
Inventors:
OGAWA AKIRA (JP)
YANO AYAKO (JP)
YANO AYAKO (JP)
Application Number:
PCT/JP2017/016217
Publication Date:
November 02, 2017
Filing Date:
April 24, 2017
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L71/02; C08K3/22; C08K5/57
Domestic Patent References:
| WO2016027471A1 | 2016-02-25 | |||
| WO2013042702A1 | 2013-03-28 |
Foreign References:
| JP2001031870A | 2001-02-06 | |||
| JP2010189542A | 2010-09-02 | |||
| JPH11172230A | 1999-06-29 | |||
| JP2006321938A | 2006-11-30 | |||
| JP2003041115A | 2003-02-13 | |||
| JP2005306891A | 2005-11-04 |
Other References:
See also references of EP 3450502A4
Attorney, Agent or Firm:
NIIYAMA, Yuichi (JP)
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