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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/090035
Kind Code:
A1
Abstract:
A curable composition which comprises a polyoxypropylene polymer (A) having crosslinkable silicon groups in the molecule, a (meth)acrylic ester polymer (B) having crosslinkable silicon groups in side chains thereof, and a (meth)acrylic ester polymer (C) having a crosslinkable silicon group at an end only. The curable composition has excellent weatherability, gives a cured composition having excellent tensile properties, and is useful as a sealing material having excellent storage stability.

Inventors:
KASAI MITSUHIRO (JP)
TAMAI HITOSHI (JP)
YANO AYAKO (JP)
Application Number:
PCT/JP2004/004806
Publication Date:
October 21, 2004
Filing Date:
April 01, 2004
Export Citation:
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Assignee:
KANEKA CORP (JP)
KASAI MITSUHIRO (JP)
TAMAI HITOSHI (JP)
YANO AYAKO (JP)
International Classes:
C08G65/48; C08L43/04; C08L71/02; C09K3/10; (IPC1-7): C08L71/02; C08L33/06; C09K3/10; C09J201/10; C09J171/02
Foreign References:
JP2000281718A2000-10-10
JP2003096195A2003-04-03
JP2002129124A2002-05-09
JPS6361076A1988-03-17
JP2003313442A2003-11-06
JP2004067918A2004-03-04
Other References:
See also references of EP 1619219A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi Osaka, 88, JP)
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