Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/007745
Kind Code:
A1
Abstract:
A curable composition which comprises (A) a polyoxyalkylene polymer having at least one reactive silicon group in the molecular ends, (B) a polymer comprising alkyl acrylate monomer units and/or alkyl methacrylate monomer units and having at least one reactive silicon group per molecule on the average, and (C) an ionic surfactant. The composition is suitable for use in a building-use sealing material which is inhibited from suffering the adhesion of dust or the like thereto and is less apt to be fouled by rainwater streak marks.
Inventors:
TAMAI HITOSHI (JP)
Application Number:
PCT/JP2004/009474
Publication Date:
January 27, 2005
Filing Date:
June 28, 2004
Export Citation:
Assignee:
KANEKA CORP (JP)
TAMAI HITOSHI (JP)
TAMAI HITOSHI (JP)
International Classes:
C08G65/336; C08L43/04; C08L71/02; C09K3/10; F16J15/10; F16J15/14; (IPC1-7): C08L71/02; C08K5/42; C08L33/06; C09K3/10; F16J15/14
Foreign References:
| JPH11193343A | 1999-07-21 | |||
| JP2003055432A | 2003-02-26 | |||
| JP2003096195A | 2003-04-03 | |||
| JP2002194204A | 2002-07-10 | |||
| JPH0931400A | 1997-02-04 | |||
| JPH07173404A | 1995-07-11 | |||
| JP2001011422A | 2001-01-16 | |||
| JPS59217757A | 1984-12-07 |
Other References:
See also references of EP 1650261A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka, JP)
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