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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/111150
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a curable composition which can be of the one-pack type which cures at room temperature through reaction with moisture in the air, and gives a cured article excellent in strength, elongation at break, weatherability, and adhesion. [MEANS FOR SOLVING PROBLEMS] The curable composition comprises: 100 parts by weight of a vinyl polymer (I) which has at least one crosslinkable silyl group and has a main chain produced by living radical polymerization; and 1-1,000 parts by weight of a polyether oligomer (II) which has one or more crosslinkable silyl groups and in which the proportion of molecular ends eachhaving a crosslinkable silyl group introduced thereinto is 85% or higher as determined by 1H-NMR analysis.

Inventors:
YANO AYAKO (JP)
TAMAI HITOSHI (JP)
Application Number:
PCT/JP2005/007801
Publication Date:
November 24, 2005
Filing Date:
April 25, 2005
Export Citation:
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Assignee:
KANEKA CORP (JP)
YANO AYAKO (JP)
TAMAI HITOSHI (JP)
International Classes:
C08G65/336; C08L43/04; C08L71/02; C08L101/10; C09J133/14; C09J151/08; C09J171/00; C09J201/10; C09K3/10; (IPC1-7): C08L101/10; C09J133/14; C09J151/08; C09J171/00; C09J201/10; C09K3/10
Domestic Patent References:
WO2002085985A12002-10-31
WO2000044796A12000-08-03
WO2000040654A12000-07-13
Foreign References:
JP2000345048A2000-12-12
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka 88, JP)
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