Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/046474
Kind Code:
A1
Abstract:
Disclosed is a solvent-free, room temperature-curable composition which has excellent water-resistant adhesion, storage stability and curability and does not generate fumes or odors during application. Specifically disclosed is a curable composition containing a bituminous substance (A) and a vinyl polymer (B) having a reactive silicon group crosslinkable by forming a siloxane bond through a silanol condensation reaction wherein the main chain is produced by living radical polymerization. Such a curable composition is excellent in water-resistant adhesion, storage stability and curability, and does not generate fumes or odors during application.
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Inventors:
KAWAKAMI ATSUSHI (JP)
ANDO KATSUHIRO (JP)
ANDO KATSUHIRO (JP)
Application Number:
PCT/JP2005/019341
Publication Date:
May 04, 2006
Filing Date:
October 20, 2005
Export Citation:
Assignee:
KANEKA CORP (JP)
KAWAKAMI ATSUSHI (JP)
ANDO KATSUHIRO (JP)
KAWAKAMI ATSUSHI (JP)
ANDO KATSUHIRO (JP)
International Classes:
C08L95/00; C08F4/06; C08K5/00; C08L33/06; C08L63/00; C08L101/10; C09J133/06; C09J163/00; C09J195/00; C09J201/10; C09K3/00; C09K3/10; E01C7/26; E04D7/00
Domestic Patent References:
WO2003085010A1 | 2003-10-16 |
Foreign References:
JP2003301112A | 2003-10-21 | |||
JPH10279812A | 1998-10-20 |
Other References:
See also references of EP 1810995A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka88, JP)
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