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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/037483
Kind Code:
A1
Abstract:
Disclosed is a curable composition containing, as a component, an organic polymer having a reactive silicon group. This curable composition uses an amine compound as a non-organic-tin catalyst, while exhibiting good adhesiveness and water-resistant adhesiveness. In addition, this curable composition is suppressed in bleed-out of a liquid compound to the surface of a cured product. Specifically disclosed is a curable composition containing an organic polymer (A) having a silicon-containing group which can be crosslinked by forming a siloxane bond, a silanol condensation catalyst (B), and a tackifier (C). This curable composition is characterized in that the silanol condensation catalyst (B) is an amine compound (B-1) having a melting point of less than 23˚C, and the tackifier (C) contains an amino group-containing silane coupling agent (C-1) and an epoxy group-containing silane coupling agent (C-2) at a specific ratio.

Inventors:
MATSUSHITA NORIKO (JP)
YANO AYAKO (JP)
Application Number:
PCT/JP2006/319719
Publication Date:
April 05, 2007
Filing Date:
October 02, 2006
Export Citation:
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Assignee:
KANEKA CORP (JP)
MATSUSHITA NORIKO (JP)
YANO AYAKO (JP)
International Classes:
C08L101/10; C08K5/17; C08K5/29; C08K5/5435; C08K5/544; C09J201/10; C09K3/10
Domestic Patent References:
WO2004022618A12004-03-18
Foreign References:
JPH06271834A1994-09-27
JP2004107397A2004-04-08
JPH0848889A1996-02-20
JPS6429460A1989-01-31
Other References:
See also references of EP 1939256A4
Attorney, Agent or Firm:
YASUTOMI, Yasuo et al. (5-36 Miyahara 3-chome, Yodogawa-k, Osaka-shi Osaka 03, JP)
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