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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/037485
Kind Code:
A1
Abstract:
Disclosed is a curable composition which is suppressed in bleed-out of a liquid compound to the surface of a cured product while using, as a silanol condensation catalyst, an amine compound which is a non-organic-tin catalyst. This curable composition is good in curability and adhesive properties. Specifically disclosed is a non-organic-tin type curable composition containing (A) an organic polymer having a silicon-containing group which can be crosslinked by forming a siloxane bond, and (B) a specific amidine compound and/or guanidine compound respectively having a melting point of not less than 23˚C as a silanol condensation catalyst.

Inventors:
MATSUSHITA NORIKO (JP)
IWAKIRI HIROSHI (JP)
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2006/319726
Publication Date:
April 05, 2007
Filing Date:
October 02, 2006
Export Citation:
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Assignee:
KANEKA CORP (JP)
MATSUSHITA NORIKO (JP)
IWAKIRI HIROSHI (JP)
OKAMOTO TOSHIHIKO (JP)
International Classes:
C08L101/10; C08K5/29; C09J201/10; C09K3/10
Domestic Patent References:
WO2004022618A12004-03-18
WO2004022618A12004-03-18
WO2003018658A12003-03-06
WO2003059981A12003-07-24
WO1997005201A11997-02-13
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Other References:
See also references of EP 1939257A4
J.P. KENNEDY ET AL., J. POLYMER SCI., POLYMER CHEM. ED., vol. 15, 1997, pages 2843
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INSATSU GAKKAI SHUPPANBU, KANKOSEI JUSHI (PHOTOSENSITIVE RESINS, 17 March 1972 (1972-03-17), pages 93 FF
Attorney, Agent or Firm:
YASUTOMI, Yasuo et al. (5-36 Miyahara 3-chome, Yodogawa-k, Osaka-shi Osaka 03, JP)
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